Antistatic Waffle Pack Chip Trays IC Packaging Protecting CSP
Anti-Static Chip Tray With Digital Array Specially Designed For The Cavity
The use of anti-static tray storage electronic components, can effectively avoid short circuit phenomenon.Because the product is prone to friction in the process of placement and transportation, if there is some static electricity on the circuit board of the product, it is easy to lead to short circuit of the circuit board, affecting the quality of the product, and may even cause damage.
Chip tray is a carrier for bare dies used for the transportation and handling of a small batch of dies. A waffle pack is typically a plastic tray with pockets sized up for a particular die size.
IC Packaging delivery systems for protecting and transporting bare die, CSP, ... die (KGD), chip scale packaging (CSP), and wafer scale packaging (WSP).
Chinese Professional Manufacturer
1. Ten years experience in the ESD tray Field
2. Adequate Supply of products
3. Professional non-standard custom
4. MPPO.PPE.ABS.PEI.IDP...etc material
5. Products follow the Jedec antistatic standard.
7. The tray is permanent unitary antistatic, cut off the headstream of the static threat of the products.
Detail Information
| Outline Size |
Material |
Surface Resistance |
Service |
Flatness |
Color |
| 2" |
ABS.PC.PPE...etc |
1.0x10e4-1.0x10e11Ω |
OEM,ODM |
Max 0.2mm |
Customizable |
| 3" |
ABS.PC.PPE...etc |
1.0x10e4-1.0x10e11Ω |
OEM,ODM |
Max 0.25mm |
Customizable |
| 4" |
ABS.PC.PPE...etc |
1.0x10e4-1.0x10e11Ω |
OEM,ODM |
Max 0.3mm |
Customizable |
| Custom size |
ABS.PC.PPE...etc |
1.0x10e4-1.0x10e11Ω |
OEM,ODM |
TBC |
Customizable |
| Provide professional design and packaging for your products |
| Outline Line Size |
50*50*5mm |
Brand |
Hiner-pack |
| Model |
HN21038 |
Package Type |
IC Parts |
| Cavity Size |
7.5X6X1.2mm |
Matrix QTY |
5*5=25PCS |
| Material |
ABS |
Flatness |
MAX 0.2mm |
| Color |
Black |
Service |
Accept OEM,ODM |
| Resistance |
1.0x10e4-1.0x10e11Ω |
Certificate |
ROHS |
Product Application
Wafer Die / Bar / Chips PCBA module component
Electronic component packaging Optical device packaging
Packaging
Packing according to customer's specified size
FAQ
Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase QTY of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterm you can do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method you can help ship the goods?
A: By sea, by air, or by express, by mail post according to customer order qty and volume.
Product Tags:
|
|
Antistatic Waffle Pack Chip Trays IC Packaging Protecting CSP Images
|
