ESD Waffle Pack Electronic Components Tray
Durable Antistatic ABS Non-Standard Waffle Pack With Different Size Can Be Customized For Optoelectronic Components
As the tray in the field of optical application, more and more customers to protect components or optical devices, are willing to choose injection molding tray for packaging solution, because the tray can carrier component also provides comprehensive protection to transit and transport provides great convenience, all kinds of specifications and various color can be realized, provide one-stop service from design to production to packaging.
A chip tray is a carrier for bare dies used for the transportation and handling of a small batch of dies. A waffle pack is typically a plastic tray with pockets sized up for a particular die size.
IC Packaging delivery systems for protecting and transporting bare die, CSP, ... die (KGD), chip scale packaging (CSP), and wafer scale packaging (WSP).
Advantages:
1. More than 12 years of export experience.
2. With professional engineers and efficient management.
3. Short delivery time and good quality.
4. Support small batch production in the first batch.
5. Professional sales within 24 hours efficient reply.
6. The factory has ISO certification, and the products comply with the RoHS standard.
7. Our products are exported to the United States, Germany, the UK, Korea, Japan, Israel, Malaysia, etc. won the praise of many customers, with service and cost performance being well recognized.
Technical Parameters:
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | TBC | Customizable |
| Provide professional design and packaging for your products |
FAQ:
Q: Can you do OEM and customized design IC trays?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase quantity of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value, and all samples shipping costs are normally is by collected or as agreed.
Q: What kind of Incoterms can you do?
A: We could support doing EXW, FOB, CNF, CIF, CFR, DDU, DAP. etc., and other terms as agreed.
Q: What method can you use to ship the goods?
A: By sea, by air, by express, by mail post according to customer order quantity and volume.
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ESD Waffle Pack Electronic Components Tray Images
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